Another Custom Component Question (2 replies and 2 comments)
OK -- Here is another question about the creation of custom components that will behave in the desired manner. How can I create a multi-part component whose individual sections can be moved independently from the other sections. An example of what I mean can be found in the standard component library in the form of the dual op-amp LM1458. Each section of this software-supplied component can be moved around in the schematic without having the other half follow it. I can't seem to emulate this desirable capability in my new components. What am I doing wrong here?
Hopefully, one of the board admins will see this topic and provide an answer... 🙂
When you make a component and group it all the parts will be grouped together. You could make multiple components and give them the same name then add a number or part description.
OK -- I figured this one out... What needs to be done is to draw and group (but DO NOT save) the first section. When you group it, you give it the Part Name and Component Type identifier, Next draw and group the second section (again, DO NOT save it) and then save them together as a Custom Component. When placed into a schematic, the individual sections will be movable independent of each other.
What should be noted is that it is not true that smear removal can help get rid of the smear and dust inside the holes as is commonly believed. Under most circumstances, the effect of smear removal technique in treating dust is very limited as the dust will form small smear micelle in the tank solution, which makes it difficult to handle the tank solution. The smear micelle attached to the walls of holes may easily become solidified inside the holes or drop off from the hole walls in the following manufacturing process, which may result in the phenomenon of dotted bronze free inside the holes. Therefore, it is necessary to conduct some mechanical ways of cleaning the board and high-pressure cleaning, especially in following the development trend and under the circumstances when small-hole board and high-aspect ratio board is becoming more and more common, and it has become a trend to remove dust inside the holes with ultrasonic waves.
This is my first time designing a PCB and I have some noob questions regarding the program. I have decided to use the top layer for logic and the bottom layer for power and play free fire ground to prevent traces from crossing over. I will be unable to solder on certain components the way. Can anyone help?